? semiconductor components industries, llc, 2005 september, 2005 ? rev. 5 1 publication order number: bsp52t1/d bsp52t1, BSP52T3 preferred devices npn small?signal darlington transistor this npn small signal darlington transistor is designed for use in switching applications, such as print hammer, relay, solenoid and lamp drivers. the device is housed in the sot-223 package, which is designed for medium power surface mount applications. features ? the sot-223 package can be soldered using wave or reflow. the formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die ? available in 12 mm tape and reel use bsp52t1 to order the 7 inch/1000 unit reel ? pnp complement is bsp62t1 ? pb?free packages are available maximum ratings (t c = 25 c unless otherwise noted) rating symbol max unit collector-emitter voltage v ces 80 vdc collector-base voltage v cbo 90 vdc emitter-base voltage v ebo 5.0 vdc collector current i c 1.0 adc total power dissipation (note 1) @ t a = 25 c derate above 25 c p d 0.8 6.4 w mw/ c total power dissipation (note 2) @ t a = 25 c derate above 25 c p d 1.25 10 w mw/ c operating and storage temperature range t j , t stg ?65 to 150 c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. thermal characteristics characteristic symbol value unit thermal resistance (note 1) junction-to-ambient r ja 156 c/w thermal resistance (note 2) junction-to-ambient r ja 100 c/w maximum temperature for soldering purposes time in solder bath t l 260 10 c sec 1. device mounted on a fr-4 glass epox y printed circuit board using minimum recommended footprint. 2. device mounted on a fr-4 glass epoxy printed circuit board using 1 cm 2 pad. device package shipping ? ordering information bsp52t1 sot?223 1000/tape & reel marking diagram sot?223 case 318e style 1 3 2 1 collector 2,4 base 1 emitter 3 4 ayw as3 a = assembly location y = year w = work week as3 = specific device code = pb?free package (note: microdot may be in either location) medium power npn silicon surface mount darlington transistor bsp52t1g sot?223 (pb?free) 1000/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. http://onsemi.com BSP52T3 sot?223 4000/tape & reel BSP52T3g sot?223 (pb?free) 4000/tape & reel preferred devices are recommended choices for future use and best overall value.
bsp52t1, BSP52T3 http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristics symbol min max unit off characteristics collector-base breakdown voltage (i c = 100 adc, i e = 0) v (br)cbo 90 ? vdc emitter-base breakdown voltage (i e = 10 adc, i c = 0) v (br)ebo 5.0 ? vdc collector-emitter cutoff current (v ce = 80 vdc, v be = 0) i ces ? 10 adc emitter-base cutoff current (v eb = 4.0 vdc, i c = 0) i ebo ? 10 adc on characteristics (note 3) dc current gain (i c = 150 madc, v ce = 10 vdc) (i c = 500 madc, v ce = 10 vdc) h fe 1000 2000 ? ? ? collector-emitter saturation voltage (i c = 500 madc, i b = 0.5 madc) v ce(sat) ? 1.3 vdc base-emitter saturation voltage (i c = 500 madc, i b = 0.5 madc) v be(sat) ? 1.9 vdc 3. pulse test: pulse width 300 s, duty cycle 2.0%
bsp52t1, BSP52T3 http://onsemi.com 3 package dimensions sot?223 case 318e?04 issue l style 1: pin 1. base 2. collector 3. emitter 4. collector *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 1.5 0.059 mm inches scale 6:1 3.8 0.15 2.0 0.079 6.3 0.248 2.3 0.091 2.3 0.091 2.0 0.079 a1 b1 d e b e e1 4 123 0.08 (0003) a l1 c notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. h e dim a min nom max min millimeters 1.50 1.63 1.75 0.060 inches a1 0.02 0.06 0.10 0.001 b 0.60 0.75 0.89 0.024 b1 2.90 3.06 3.20 0.115 c 0.24 0.29 0.35 0.009 d 6.30 6.50 6.70 0.249 e 3.30 3.50 3.70 0.130 e 2.20 2.30 2.40 0.087 0.85 0.94 1.05 0.033 0.064 0.068 0.002 0.004 0.030 0.035 0.121 0.126 0.012 0.014 0.256 0.263 0.138 0.145 0.091 0.094 0.037 0.041 nom max l1 1.50 1.75 2.00 0.060 6.70 7.00 7.30 0.264 0.069 0.078 0.276 0.287 h e ? ? e1 0 1 0 0 1 0
bsp52t1, BSP52T3 http://onsemi.com 4 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 bsp52t1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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